The annual SEMICON China Shanghai Semiconductor Exhibition will be held in Shanghai Pudong New International Expo Center on March 17-19, 2021. This world's largest annual semiconductor event is to understand the global industrial structure, cutting-edge technology and market trends, and share A rare opportunity for the wisdom and vision of global industry leaders! As a professional semiconductor packaging and testing equipment manufacturer,
Biaopu Semiconductor will also bring its self-developed semiconductor and passive component packaging and testing equipment to the 2021 Shanghai SEMICON Semiconductor Exhibition. We sincerely invite you to visit Biaopu’s booth and discuss China’s semiconductor industry. Equipment technology innovation and the road to future development.
Exhibition name: 2021 SEMICON China Shanghai Semiconductor Exhibition
Exhibition time: March 17-19, 2021 (Wednesday-Friday)
Biaopu Booth: Hall T3 T3201
Exhibition address: Shanghai Pudong New International Expo Center
Shenzhen Biaopu Semiconductor Technology Co., Ltd. was established in 2011. It is a semiconductor packaging and testing equipment manufacturer integrating R&D, production, sales and service. The company specializes in the production of LED, semiconductor and passive component packaging and testing equipment. Now it has an independent factory area of 15,000+ square meters and a machining center of nearly 4,000 square meters. Precision equipment: The company has more than 400 employees and a research and development team of nearly 100 people. It has focused on the packaging and testing field for nearly 20 years. The core components of packaging and testing equipment such as vibrating disks, image control and testing systems are all independently developed and produced.
The packaging and testing equipment independently developed by Biaopu Semiconductor, after years of technology accumulation and business development, has an ultra-high market share, with customers covering East China, North China, Central China, South China, Southwest China, South Korea, Vietnam, India, Indonesia, etc. Regional market.
At this exhibition, Biaopu Semiconductor will exhibit its self-developed semiconductor packaging and testing equipment. For semiconductor IC components and passive components, the packaging and testing equipment adopts the self-developed loading and testing systems of Biaopu. After years of technology accumulation and Innovative, with stable and efficient operation, and won unanimous praise from domestic and foreign component manufacturers.
Semiconductor IC series
The semiconductor series test and taping equipment independently developed by Biaopu can realize the functions of component detection, marking, and taping, and are widely used in semiconductor related components:
Transistor: SOD, SOT IC
small model: QFN, DFN
IC models: SQIC8, SOP8
TO series components
Passive component series
The passive component series packaging and testing equipment independently developed by Biaopu Semiconductor can realize the functions of component detection, marking, and taping, which are widely used in various passive component products:
Passive components: chip resistors, capacitors, inductors, etc.
Discrete components: secondary and tertiary tubes
Other SMD electronic components