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Promote the development of strategic emerging industries in Dongguan, and set up a 40-mu high-end equipment project in Changping
Release time:2021.05.25
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Dongguan Strategic Emerging Industry Investment Conference was successfully held  On May 21, the Dongguan Municipal People's Government held a strategic emerging industry investment conference, and set up branch venues in 6 countries and regions including Japan, Germany, Israel, the United Arab Emirates, Hong Kong, and Macau.  Provincial and municipal leaders as well as Siemens, SAP, KPMG, DTZ, JD.com, Fosun, Messer, High Link Capital, Zhilu Capital and other Fortune 500 companies in the world, Fortune 500 in China, well-known companies in the industry, listed companies, investment institutions, and key points Approximately 400 guests from the Chamber of Commerce and Industry participated in the meeting. The participating merchants have a strong willingness to invest in Dongguan, and the atmosphere for on-site matchmaking negotiations is enthusiastic. The total investment in the contracted projects reached 148.3 billion yuan.

(Dongguan Strategic Emerging Industry Investment Conference was officially held)


Biaopu Semiconductor and Dongguan Changping Government signed a cooperation agreement  

Shenzhen Biaopu Semiconductor Technology Co., Ltd. Chairman Tuo Changchuan attended the Dongguan Strategic Emerging Industry Investment Conference. At the signing ceremony, he signed the "Bao "Spectrum Semiconductor Intelligent Equipment Production Center Project" cooperation agreement. The project is planned to be constructed in Changping, Dongguan, with a total investment of 700 million yuan, covering an area of 40.61 acres (state-owned land), and a total construction area of 100,000 square meters. It is mainly engaged in the research and development, production and sales of semiconductor automation equipment. Products include LED, passive Automatic inspection and packaging equipment for semiconductor components such as components and semiconductor components. 


(Tuo Changchuan, Chairman of Biaopu Semiconductor, attended the signing ceremony)


(Biaopu Semiconductor officially reached a cooperation agreement with the Changping Town Government of Dongguan)


The rise of domestic semiconductor packaging and testing equipment

The standard spectrum intelligent equipment is promising  The official settlement of the smart equipment project in Changping, Dongguan, not only reflects the strong support of the Dongguan Municipal Government in the field of high-end smart manufacturing, but also a performance of the continuous rapid development of Biaopu Semiconductor since its establishment 10 years ago. From the early days of its establishment, it has been unknown to more than 600 employees. As a high-tech enterprise integrating R&D, production and sales, Biaopu Semiconductor has been continuously increasing R&D efforts and actively expanding production capacity, aiming to provide customers with advanced, efficient and stable semiconductor packaging and testing equipment, and at the same time leading domestic packaging It has contributed an indispensable force in the process of technological innovation of measuring equipment and reserve of core technology.

(A series of packaging and testing equipment independently developed by Biaopu Semiconductor-part of the show)

Biaopu Semiconductor is located in the field of semiconductor packaging and testing equipment, which is the high-tech industry supported by the country in recent years. Faced with the blockade and difficulties of foreign technology, the localization of semiconductor technology is imminent. Biaopu Semiconductor is facing opportunities and challenges. Relying on years of deep cultivation and technical accumulation in the field of semiconductor packaging and testing equipment, relying on the stable market share of LED spectroscopic taping equipment, it has continuously developed a series of packaging and testing equipment such as passive components, semiconductor components, and appearance testing, and independently developed vibration The core parts of packaging and testing equipment such as disks, image control, and test systems make key technologies no longer subject to others, and also set a good benchmark for domestic semiconductor packaging and testing equipment.


(A series of packaging and testing equipment independently developed by Biaopu Semiconductor-detail display)

In the future, the industrial scale of semiconductor packaging and testing equipment will continue to expand, especially the rise of domestic series of equipment, which will gradually replace expensive imported equipment. Facing increasingly sophisticated electronic components and growing market demand, it will be stable Technological development and sufficient production capacity guarantee will be a major challenge for us. Biaopu Semiconductor has learned from the past, this time the advance layout of the high-end intelligent equipment industry is also the expression of confidence in the semiconductor packaging and testing equipment market and its own strength. The key issues such as technology and production capacity will greatly boost the market’s recognition of Standard Spectrum Semiconductor, and will also lay a solid foundation for seizing the high ground in the field of domestic packaging and testing equipment.

The current Biaopu Semiconductor is developing steadily, technological innovation is moving forward steadily, and various managements are improving day by day. In the past, we thank you for your trust and support. In the future, we look forward to working with you to develop together and take advantage of the trend. Expect it!



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