Passive (SMD) component testing package machine
1. High stability and low failure, easy to maintain; can realize product model switching
2. Can realize automatic replenishment & self-feeding, high efficiency and low cost
3. It can realize functions such as scanning code to prevent foolishness, automatic cutting and rewinding, automatic product coding, automatic label printing, MES remote monitoring, etc.
4. It can support 3 stations visual inspection, which can check for chipping, sticking tin, reverse material, no material, 90 degree turning, character NG, etc.
5. Test tape loading machine for patch products and bottom test products
PRODUCT DESCRIPTION
MACHINE FEATURES
Efficient and stable
High stability and low failure, easy to maintain; can realize product model switching
MACHINE FEATURES
Lower the cost
Can realize automatic replenishment & self-feeding, high efficiency and low cost
MACHINE FEATURES
Intelligent management
It can realize code scanning to prevent foolishness, automatic cutting and rewinding, automatic product coding, Automatic label printing, MES remote monitoring and other functions
MACHINE FEATURES
Accurate detection
It can support 3 stations of visual inspection, which can check for chipping, tin sticking, reversed material, No material, 90 degree turning, character NG, etc.
MACHINE FEATURES
Applicable components
Test tape loading machine for patch products and bottom test products
SPECIFICATIONS
Adaptation elementChip components such as chip resistors, inductors, capacitors, fuses, etc.Separation DepartmentFaults can be automatically eliminated
Component sizeFlake British 01005~2512Test socketBottom four-wire system test possible
Running speedMaximum speed 5300PCS/minTest equipment support8 punch holes, the tape reel can be used in conjunction
Image systemUp to 3 stations vision systemDimensions1130mm x 750mm x 1830
Feeding methodVibrating plateWeight300kg
Sealing methodRepeated hot pressingPower supplyAC220V/50HZ
Upper peel force16-60gfPower1kw
Test instrumentOptional testing equipment (HIOKI, ADEX, AGLLENT, etc.)


APPLICATIONS
Passive components:
The passive component series packaging and testing equipment independently developed by Biaopu Semiconductor can realize the functions of component detection, marking, and taping, which are widely used in various passive component products:
Passive components: chip resistors, capacitors, inductors, etc.;
Discrete components: secondary and tertiary tubes;
Other SMD electronic components;
The passive component series packaging and testing equipment independently developed by Biaopu Semiconductor can realize the functions of component detection, marking, and taping, which are widely used in various passive component products: Passive components: chip resistors, capacitors, inductors, etc.; Discrete components: secondary and tertiary tubes; Other SMD electronic components;
PRODUCT VIDEO
Running video
Passive (SMD) component testing package machine
Passive (SMD) component testing package machine
DOWNLOAD
We look forward to communicating with you the research results of semiconductor packaging and testing related fields, Achieve win-win cooperation
Our contact number
0755-2738 0319
Our email address
> Learn about our products
Online
Phone
0755-2738 0319
We look forward to communicating with you the research results of semiconductor packaging and testing related fields, Achieve win-win cooperation
Our contact number
0755-2738 0319
Our email address
> Learn about our products